Electronic & Electrical Materials
With a deep understanding of materials science, a commitment to technology leadership, a wide range of process expertise and a long history of innovation, DuPont offers the industry’s broadest array of high performance electronic and electrical materials.
The DuPont electronics and electrical portfolio includes materials for hybrid, rigid and flexible circuits; specialized ceramic, polymer thick film compositions (PTF) and GreenTape™ low temperature co-fired ceramic (LTCC) materials; and materials for the fabrication and packaging of semiconductors.
When you’re designing products that require electrical insulation systems (EIS), DuPont can make your job easier because we offer the industry’s largest number of EIS that have been pre-approved by Underwriters Laboratories (UL) and recognized to IEC standards. These systems include a wide range of DuPont materials including: films, varnishes, aramid papers, pressboard products, thermoplastic resins and wire enamels.
- Pyralux® Flexible Circuit Materials
- Oasis® Composite Films
- Riston® Dry Film Photoresist
- Kapton® polyimide film
- Wafer Level Packaging Solutions
- Interra™ thin copper clad laminates
- Nomex® Electrical Insulation
- Kalrez® perfluoroelastomer parts
- Vespel® Parts & Shapes
- Upcoming Webinar: Collaborative Solutions in Insulation Optimization
- Upcoming Webinar: Materials Optimization Using Real-World Laboratory Test Data
DuPont Collaborates with Industry Pioneers to Showcase Advanced Wearable Electronics
Through integration efforts by DuPont, and five industry pioneers will jointly exhibit various advanced wearables applications that use DuPont stretchable electronics inks in garments, insoles and other novel applications.
- New Guide to NHFR Polymers for Electrical and Electronic Applications
DuPont Launches New Portfolio of Electronic Thermal Management Solutions
The portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films and adhesive thermal tapes.
DuPont Introduces New Conductive Ink for Digital Printing
The technology will enable digital printing for electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels.
Advanced Materials Enable Wearable, In-Mold, High- and Low-Temperature Electronics
New materials include conductive inks for wearable and in-mold electronics, and materials that can be processed at very high or low temperatures, expanding the range of applications in the growing printed electronics field.
DuPont Introduces New In-Mold Electronic Inks
DuPont Microcircuit Materials is introducing a suite of in-mold electronic inks designed to help streamline electronic devices by reducing the need for rigid circuit boards. The inks offer important design, manufacturing, weight and cost advantages.
DuPont Microcircuit Materials Introduces New Inks for Printed Electronics
The new DuPont™ PE827 and PE828 low-temperature inks cure at as low as 60°C, opening up the possibility for printed electronics designers to use less expensive plastic films.
Pyralux® TK Flexible Circuit Material Used in Molex High-Speed Low-Loss Flex Circuit Assemblies
The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.
DuPont Introduces New Pyralux® High Temperature Flexible Circuit Material System
The Pyralux® HT 225ºC service temperature enables designers to use flexible circuits for the first time in high-temperature environments such as aerospace and automotive engines, brakes and transmissions, and downhole pumps for oil and gas drilling.
DuPont Introduces Stretchable Inks for Wearable Electronics
DuPont Microcircuit Materials has introduced a suite of stretchable electronic ink materials for use in smart clothing applications and other wearable electronics.
DuPont Introduces Pure Copper Conductive Ink
DuPont Microcircuit Materials is introducing its first pure copper conductive ink for photonic curing, DuPont™ PE510 copper conductor. DuPont™ PE510 is a cost-effective alternative to silver conductor inks for a variety of applications.
DuPont Microcircuit Materials Extends Printed Electronics Research and Holst Centre Collaboration
DuPont and Holst Centre have extended their collaboration focused on advanced materials for the printed electronics industry.
USES AND APPLICATIONS
- Electrochemical Biosensors
- Blood Glucose Test Strips
- Kapton® multi-layer insulation films protect NOAA satellite
- Restoring the Apollo Telescope Mount
- Printed Materials for Patient Monitoring and Warming
- Materials for Electronic Warfare
- Advanced Materials for Satellite Communications
- GreenTape™ 9K7 LTCC for Transceiver Systems
- Liquid Immersed Transformers
- Dry Type Transformer Insulation
- Vertak® High Performance Adhesive for Ruggedized Applications
- Vertak® High Performance Adhesive for Consumer Electronics
INFORMATION & IDEAS
- 3rd Wearable Expo 2017
- How Do Batteries Work?
OLED Process Technology Achieves Significant Cost Savings
DuPont OLED liquid printing process technology, is projected to be approximately 30% below incumbent LCD costs
White Paper: NHFR Polymers for Electrical and Electronic Applications
How to meet regulatory, environmental, safety and performance challenges in electrical and electronic componnents with DuPont NHFR polymers
- Vehicle Design Options Multiplied
- Car Manufacturing Costs
- Stretchable Inks: Changing the Wearables Market
- Smart & Stretchable
- DuPont Collaborates with Molex on New High Speed Flexible Interconnects
Fusabond® Resins as Coupling Agents in Halogen-Free Wire & Cable Applications
Extensive trials have been undertaken using Fusabond® E as a coupling agent in halogen-free, flame retardant wire and cable formulations...
- Zytel® PA: An Ideal Electrical Polymer
- High Temperature Electrical Insulation